Press Release

Universal Instruments to Demonstrate Latest Technologies at NEPCON China 2008

Universal Instruments (booth 1C15) will demonstrate the state-of-the-art surface mounting technologies, including system-in-package (SiP) applications, odd-form components solutions and high speed chip placement solutions to manufacturers to meet the changing needs in today’s dynamic market at NEPCON China 2008 to be held at Shanghai Everbright Convention and Exhibition Center from April 8 to 11.

April 2, 2008 - With the trend towards miniaturization and high integration, Universal Instruments has specially featured SiP application which can directly assemble bare die onto end products. The solution on display involves Universal Instruments’ multi-function platform GX-11S, Unovis Solutions’ Direct Die Feeders, and special functions on IR heating, UV curing, and fluxing which are required by semiconductor process and SiP assembly process.

Heinz Dommel, Asia Sales Director of Universal Instruments Corporation, said, “With the increasing popularity of SiP applications, we are expecting to see more and more manufacturers undergoing SiP assembly in their SMT production lines.

“Our Direct Die Feeding solutions on display fill the technology gap on feeding in the die onto the SMT machines at high speed with high accuracy. We are now integrating semiconductor applications into SMT lines and are foreseeing a growing convergence between semiconductor and SMT packaging technologies. Universal Instruments is pledged to continue our efforts in providing our customers the latest technology to meet changing market demands.”

SiP combines several functions like wireless communications, logic and memory into one single small module. Its application enables the production of smaller, lighter, and cheaper products with more functions and better performance. SiP is already widely applied on products including Bluetooth, cellphones, medical equipments, automobile electronics, power devices, GPS and so on.

Li Yi, SMT Process Research Engineer of Universal Instruments, will deliver a presentation on “A Look into the Demand and Challenges of SiP Applications” at a NEPCON conference to be held on April 9.

During the exhibition, Universal Instruments will continue to display its flagship product GC-120Q. Equipped with four lightning heads, this quad-gantry model has a maximum throughput of up to 120,000cph and can handle a wide range of components from 01005 to 30 mm2. The speed of GC-120Q will be demonstrated through a high-volume assembly of cellphones.

In addition, the Universal Instruments single beam platform GC-30S and SMA feeders will demonstrate high speed and high accuracy memory module assembly while mid-range AdVantis platform AX-72E will demonstrate its superior flexibility through odd-form component assembly.

Apart from providing high performance equipments, Universal Instruments’ Advanced Process Laboratory in Shanghai helps customers solve technical issues. Equipped with a full production line, the laboratory can offer prototyping, failure analysis and other process support. Our toll-free 24X7 Asia hotline (800-2255-2842) can offer immediate support to customers in English or Chinese anytime.

For more information, contact a Universal Sales Rep.