Flip Chip Reliability

Category: Flip Chip and Die Placement
Post Date: July 19, 2004
Author(s): Peter Borgesen, Ph.D., Surface Mount Laboratory, Universal Instruments; Daniel Blass, Surface Mount Laboratory, Universal Instruments Corporation; and K. Srihari, Ph.D., State University of New York at Binghamton

Description
The attachment of flip chip onto organic substrates, whether in component manufacturing or as part of integrated SMT assemblies, offers a series of widely publicized advantages. It does, however, also offer a variety of challenges, including a number of unique reliability issues. The present paper draws a comprehensive picture of flip chip reliability, with particular emphasis on the effects of thermal excursions on assembly damage and failure, based on modeling and failure analysis of a large variety of assemblies.