Single Mode Laser Diode Packaging

Category: Optoelectronics
Post Date: July 20, 2004
Author(s): Peter Borgesen, Surface Mount Laboratory, Universal Instruments

Description
The development of optimized optoelectronics manufacturing processes may often require some understanding of the optics as well as of the mechanical and thermal design, materials, and process issues. This is certainly the case for the packaging of single mode laser diodes, where optical alignment and coupling plays a dominant role. Referring to a couple of current generic packages for illustration we discuss some of the manufacturing issues involved as well as potential improvements. Topics addressed include alternatives in terms of package design and contents, optical alignment and coupling schemes, and the use of laser welding, soldering, and adhesives.