White Paper

Pin-in-Paste, or Alternative Assembly and Reflow Technology

Category: Pin-in-Paste
Post Date: July 20, 2004
Author(s): David Vicari, Process Research Engineer, Surface Mount Technology Laboratory, Universal Instruments

Description
Pin-in-paste - a form of intrusive reflow, also known as Alternative Assembly and Reflow Technology (AART) - can significantly enhance the productivity of your mixed-technology assembly operations. It provides manufacturers with a high-yield process that simultaneously reflows solder for surface mount, through hole, and odd form components - without the need for wave soldering. By eliminating that step of the assembly process altogether, pin-in-paste not only saves time, reduces production costs, and increases throughput, but also enhances solder reliability while removing dross as a hazardous material in the manufacturing environment.

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